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G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset
87% of respondents would recommend this to a friend
PKR 4720
Price Details
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GENNEL G109 Heatsink Plaster is the perfect solution for thermal conductivity and strong adhesion in all types of heatsinks without a fixed clip.
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What Stands Out
Product Details
- Non-electrical conductive, non-corrosive, non-toxic
- Suitable for heatsinks without fixed clip
- Good thermal conductivity and wide service temperature range (-60~280 degrees Celsius)
- Heat conducting properties with strong adhesion
- Recommended coating thickness: 0.1-0.5mm
- Wide range of applications including MOSFET, LED, heat sinks, graphics card, and electrical appliances
| Package Weight | 1.18 Pound |
Who Should Buy?
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Electronics Hobbyists
Ideal for DIY projects involving electronics where thermal conductivity and strong adhesion are necessary.
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Computer Builders
Perfect for securing heatsinks on GPUs and CPUs, ensuring optimal heat transfer and performance.
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Repair Technicians
Useful for quick repairs on various electronic components that require durability and effective thermal management.
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General Household Use
Not suitable for typical home repairs, as it is designed specifically for thermal conduction applications.
Product Description
G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset IC High Performance
About This Item
Introducing the GENNEL G109 10gram Thermal Conductive Glue - the perfect solution for all your heat dissipation needs. Designed with high performance in mind, this silicone adhesive compound is ideal for a wide range of applications, from LED and GPU heatsinks to printer chipsets and ICs. With its thermal properties and strong adhesion, this heatsink plaster ensures optimal heat transfer, keeping your electronic components cool and performing at their best. The GENNEL G109 is specifically formulated to provide superior thermal conductivity with a rating of over 1.2W/m-K, allowing for efficient heat dissipation. Not only does this thermal conductive glue excel in its performance, but it also offers exceptional reliability.
It has a melting capacity of 0 at 200 degrees Celsius for 24 hours, ensuring it remains stable under even the most demanding conditions. Additionally, its evaporation rate is incredibly low at just 0.001% over the same time period. The GENNEL G109 comes in a convenient 10 gram tube, providing you with enough adhesive to tackle multiple projects. Whether you're working on MOSFET heatsinks, VGA cards, or Northbridge and Southbridge heatsinks, this versatile solution has got you covered. Say goodbye to thermal issues and hello to improved performance with the GENNEL G109 10gram Thermal Conductive Glue.
Don't settle for subpar heat dissipation - choose the adhesive trusted by professionals and enthusiasts alike. Order yours today and experience the difference in thermal management.
Customer Questions & Answers
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Question:
How to Shop G109 10gram Thermal Conductive Glue, Heatsink Online From Ubuy?
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Question:
Is G109 10gram Thermal Conductive Glue, Heatsink Available to Shop Online in Pakistan?
Answer: Yes, at Ubuy Pakistan this product is available for you to shop at a reasonable price. The G109 10gram Thermal Conductive Glue, Heatsink is not available locally but you can trust us with our express shipping services. -
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How Long Does It Take to Get Product After Placing the Order?
Answer: The delivery time of your ordered product varies as per what you've ordered and the shipping method that you've chosen. The estimated delivery time is mentioned during the checkout process, so be carefree while shopping.
GENNEL Electrically Conductive Adhesives Editorial Review
G109 10g Thermal Conductive Glue, Heat Sink Adhesive, Silicone Glue is an impressive silicone viscous adhesive compound, ideal for bonding thermal components in electronic applications, offering excellent thermal conductivity of 1.2 W/m-K. Users have praised its medium-thick fluid consistency, which makes application straightforward without running, ensuring neat application around LED GPU and other components. However, many have noted that it requires a considerable amount of time to cure, often exceeding one week for complete hardening. This slow curing can be an advantage for those needing extra working time, allowing adjustments before the adhesive sets. Overall, users recommend it for creating strong, permanent bonds when attaching heat sinks and other components, though caution is advised for disassembly.
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Pros
- Excellent thermal conductivity for efficient heat transfer
- Easy application without running or dripping
- Strong permanent bonds ideal for electronics
- Long working time allows for adjustments
- Reusable even after months of opening
Cons
- Cures slowly, requiring patience before full strength is reached.
Product Price History
Important information
- Limitations : For products shipped internationally, please note that any manufacturer warranty may not be valid; manufacturer service options may not be available; product manuals, instructions, and safety warnings may not be in destination country languages; the products (and accompanying materials) may not be designed in accordance with destination country standards, specifications, and labeling requirements; and the products may not conform to destination country voltage and other electrical standards (requiring use of an adapter or converter if appropriate). The recipient is responsible for assuring that the product can be lawfully imported to the destination country. When ordering from Ubuy or its affiliates, the recipient is the importer of record and must comply with all laws and regulations of the destination country.
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PKR 4720
Order now and get it around Saturday, August 29
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
QTY:
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Features & Benefits
- Suitable for all heatsink types
- Thermal conductivity:> 1.2W/m-K
- Strong adhesion
- Zero melting capacity in 24 hours at 200 ℃
- Evaporation: 0.001% (200 ℃ / 24Hours)
- Dissipation coefficient
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